Education and Industry Expertise
Education
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Doctor of Philosophy (PhD) in Systems Engineering
Colorado State University, Fort Collins, CO
(2025)
Focused on advancing systems engineering methodologies, artificial intelligence applications, and multi-agent systems in complex domains such as healthcare and semiconductor manufacturing.
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Master of Science (MS) in Systems Engineering
Johns Hopkins University, Baltimore, MD
(2019)
Specialization in microelectronics, semiconductor design, and advanced manufacturing technologies. Thesis: "DoD Chip Manufacturing Foundry Management System (DCMFMS)".
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Bachelor of Science (BS) in Electrical Engineering
The City College of New York, New York, NY
(2003)
Emphasis on circuit design, semiconductor, embedded systems, and telecommunications.
Industry Experience
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Sr. Principal Integrated Product Development Team (IPDT) Lead - Northrop Grumman
Oct 2016 - Present | Baltimore, MD
Leading Systems Engineering and Integration, Product Development, and Cost Control for advanced aerospace systems.
Key skills: Earn Value Management (EVM), Cost Control, Agile Methodologies, Cross-functional Team Leadership, Program Management, Product Management, Technical Project Leadership, Systems Engineering, Risk Management. -
Member of Technical Staff, Physical Design Enablement Engineer - GLOBALFOUNDRIES
Apr 2015 - Oct 2016 | Albany, NY
Test structures to validate technology ground rules and predict end-of-line product yield.
Key skills: Semiconductor Device Characterization, Process Development, Yield Prediction, Data Analysis, and CMOS Technology Integration. -
Sr. Lead CMOS Process Integration Sr. Engineer - Samsung Electronics
Oct 2013 - Apr 2015 | Austin, TX
Led semiconductor process integration with a focus on failure analysis, semiconductor device development, and process optimization.
Key skills: Lean Manufacturing, Process Integration, Failure Analysis, Semiconductor Devices, Technology Development, Engineering Management, Continuous Improvement, DFM (Design for Manufacturability), and Cross-functional Collaboration. -
Business Process Transformation Engineer - IBM
Oct 2011 - Aug 2013 | East Fishkill, NY
Focused on Lean Transformation and Business Process Design/Analysis for process optimization.
Key skills: Lean Manufacturing, Lean Six Sigma, Business Process Design, FMEA (Failure Modes and Effects Analysis), Quality Management, Data Analysis, Process Improvement, and Continuous Improvement. -
Staff Silicon Technology Development Engineer - IBM Semiconductor Research & Development Center
Aug 2006 - Oct 2011 | East Fishkill, NY
Worked on IBM Server Technology development and silicon process assurance. Led efforts in process improvement, data analysis, and electronics.
Key skills: Electrical Engineering, Circuit Design, DFM (Design for Manufacturability), CMOS, Process Integration, Process Improvement, and Cross-team Collaboration. -
Semiconductor FEOL Process Development Engineer - IBM Research Lab
2004 - 2006 | Yorktown Heights, NY
Worked as a Semiconductor FEOL Process Development Engineer for advanced CMOS research.
Key skills: Semiconductor Process, Process Engineering, Failure Analysis, Semiconductor Device Development, Semiconductor Manufacturing, Technical Reviews, Continuous Improvement, Cross-team Collaboration, and Root Cause Analysis. -
Research Assistant - Research Foundation of CUNY
2003 - 2004 | New York, NY
Collaborated with IBM TJ Watson research center, working in the Nonlinear Optics Laboratory and Materials & Device Laboratory in the Electrical Engineering Department.
Key skills: Semiconductor Process Development, Experimental Design, Research Methodology, and Cross-disciplinary Collaboration.
