Graduate Exam Abstract

Aaron Smull

M.S. Final
July 6, 2017, 2:00 pm - 4:00 pm
C101B (ECE Conference Room)
The Conformal Perfectly Matched Layer for Electrically Large Curvilinear Higher Order Finite Element Methods in Electromagnetics

Abstract: The implementation of open-region boundary conditions in computational electromagnetics for higher order finite element methods presents a unique set of challenges. One such boundary condition is known as the perfectly matched layer. In this presentation, the generation of perfectly matched layers for arbitrary convex geometric hexahedral meshes is discussed, with a formulation that can be used to without differential operator based absorbing boundary conditions or coupling to boundary integral equations.

Adviser: Branislav Notaros
Co-Adviser: N/A
Non-ECE Member: Don Estep
Member 3: Ali Pezeshki, Electrical and Computer Engineering
Addional Members: N/A

1. A. B. Manic, A. P. Smull, F-H. Rouet, X. S. Li, and B. M. Notaros, “Efficient Scalable Parallel Higher Order Direct MoM-SIE Method with Hierarchically Semiseperable Structures for 3D Scattering”, IEEE Trans. Antennas and Prop., pp. 2467-2478, Vol. 65, 2017

2. A. P. Smull, A. B. Manic, S. B. Manic and B. M. Notaros, “Double higher-order FEM modeling using an anisotropic conformal perfectly matched layer,” 2016 IEEE Int. Symp. on Antennas and Propag, pp. 1119-1120, IEEE, 2016.

3. B. M. Notaros, A. B. Manic, A. P. Smull, S. B. Manic, X. S. Li, F-H. Rouet, “Multiscale electromagnetic modeling using double-higher-order quadrilateral meshes and parallel MoM-SIE direct solutions,” 2016 IEEE Int. Symp. on Antennas and Propag, pp. 235-236, IEEE, 2016.

4. A. P. Smull, A. B. Manic, S. B. Manic, and B. M. Notaros, “Anisotropic Locally-Conformal Perfectly Matched Layer for Higher-Order Curvilinear Finite-Element Modeling”, Submitted to IEEE Trans. Antennas and Prop., undergoing revision

5. M. Ahadi, M. Kabir , et al. “Non-Intrusive Pseudo Spectral Approach for Stochastic Macromodeling of EM Systems using Deterministic Full-wave Solvers”, IEEE Conference on Electrical Performance of Electronic Packaging and Systems, 2014

Program of Study: