PHOTO: William Cotton/Colorado State University
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Lighting the way: A new tabletop extreme ultraviolet laser.
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A new type of X-ray laser could give hope to the
semiconductor industry as it struggles to continue its
march toward miniaturization. This next-generation
chip-making tool was developed at the National Science
Foundation’s Engineering Research Center for Extreme
Ultraviolet Science and Technology, located at Colorado
State University, in Fort Collins.
The laser operates at wavelengths of 18.9 and
13.9 nanometers, the latter fine enough for extreme
ultraviolet (EUV) lithography, which will be needed to
manufacture the generation of chips that are to become
available around 2011. The Colorado team found a way to
take a small “seed” of EUV light, also called soft
X‑rays, and amplify the seed to produce a beam 400 times
as intense. Finding a suitable light source for EUV
lithography machines has proved much more difficult than
expected, and though the Colorado laser is not yet
powerful enough to replace the light sources already in
development, its tabletop size and optical quality could
accelerate the development of EUV components and
materials.
The Colorado group, led by IEEE Fellow Jorge Rocca,
generated low-energy seed pulses of EUV light by firing
a titanium-sapphire laser through a neon-gas cell. The
interaction between the laser and the neon generated
harmonics—low-energy laser light at multiples of the
original laser’s frequency. The harmonics were fed to
an amplifier, which is really a plasma made by
irradiating polished molybdenum or silver slabs with
pulses from another laser. The amplifier boosts the
power only of the desired wavelengths. Molybdenum
amplified the 18.9-nm wavelength, and silver boosted the
13.9‑nm wavelength required for EUV.
Chip makers will begin to need EUV for
state-of-the-art chips by 2011 or 2012, when the
features that make up transistors must be just 22 nm. On
most advanced chips today, they are 65 or 45 nm.
The chief challenge in getting EUV lithography ready
for its debut has been the light sources [see “Plans for
Next-Gen Chips Imperiled,” IEEE Spectrum,
August 2007]. At the moment, the leading light sources
generate EUV light by blasting droplets of tin with
kilowatt-class carbon-dioxide lasers. The tin becomes
a plasma and reradiates some of the laser’s energy at
13.5 nm. Cymer, of San Diego, Calif., recently reported
reaching a record 100 watts of light using that process,
but only in short bursts.
The problem with the existing EUV sources is that the
light produced is not coherent—that is, its waves are
not all in phase with one another, according to Stefan
Wurm, who manages extreme ultraviolet strategy at
Sematech, the independent, nonprofit semiconductor
industry consortium responsible for helping the
industry develop new chip-making technologies. Coherent
light is better for most applications. “You reduce power
if you turn incoherent sources into coherent sources by
filtering,” says Wurm. And the lower the power, the
longer it takes to form patterns on a chip.
“The most important aspect of this work is the
demonstration of an almost fully coherent soft X-ray
laser,” says Rocca, head of the Colorado team. “Coherent
soft X-ray light can be used to measure the properties
of materials and directly write patterns with nanoscale
dimensions. It can also be used to look for extremely
small defects in the masks that will be used to print
the future generations of semiconductor chips.”
The new EUV lasers demonstrated by Rocca’s group will
prove valuable to semiconductor industry research right
away, predicts Wurm. In particular, he thinks they’ll be
used in developing and testing photoresists—the polymers
that harden when exposed to light, thus capturing the
light’s pattern on the chip. If chemists can reduce the
amount of energy needed to set resists, then
EUV-light-source makers have an easier goal to attain
for the power level of their sources.
The logical next step is to increase the energy of the
output pulses by increasing the energy of the seed pulse
and the volume of the amplifier, Rocca says. “More power
will make the lasers easier to use.”