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Objective

Deposition of silver through electrolytic plating

Problem:
Uncontrolled silver deposition on the target device

Device description:
The device should be capable of depositing 10 to 15µm of pure silver on the experiment copper target device.

Current situation:
The electroplating of silver is currently performed by an external shop; therefore, little control is exerted over properties pertaining to electroplating such as thickness, surface quality, and purity

Objective:
To build a device with controlled electroplating capability
1. Deposition thickness up to 15µm
2. Uniform surface finish
3. Controlled deposition rate